Injection molding
The LDS material is used to inject the parts that will be directly structured by laser.
Laser activation
A special additive is added to the resin to have a laser-activating function. When laser engraving, a physicochemical reaction forms a metal core, which acts as a catalyst in copper plating.
The process of metallization is to clean the part first, followed by electroless copper plating, forming the copper layer with thickness of about 5-8 渭m, and finally nickel and gold are plated.
Assembly
Antennas, sensors, other electrical and electronic components
Series |
Grades |
Description |
PC/ABS |
Vismid庐聽3200LDS |
Very good 聽toughness聽and聽dimensional stability |
Vismid庐聽3201LDS |
UL 94 V-1; very 聽 good toughness and dimensional stability |
|
PC |
Vismid庐聽2100LDS |
Excellent 聽toughness聽and聽dimensional stability |
Vismid庐聽2102LDS |
UL 94 V-0; excellent toughness and dimensional 聽 stability |
|
Vismid庐聽SOL 2100LDS |
Colorable, excellent toughness & dimensional stability |
|
Vismid庐聽SOL 聽 2102LDS |
Colorable, UL 94 聽 V-0; excellent toughness and dimensional stability |
|
Vismid庐聽SOL 聽 2360LDS |
30% GF reinforced, colorable, high strength聽and聽stiffness, 聽 excellent dimensional stability |
|
PA10T |
Vismid庐聽SOL 6360LDS |
30% GF reinforced, high strength,聽superbly 聽 low water absorption,聽high temperature resistance, suitable for SMT 聽 lead-free soldering |
Vismid庐聽SOL 65250LDS |
35% GF/Mineral 聽co-reinforced, superbly low water absorption, low warpage, high dimensional 聽 stability, high聽 temperature resistance, suitable for SMT lead-free 聽 soldering |
|
Vismid庐聽SOL 聽 6954LDS |
Thermally conductive; superbly low water absorption, 聽 low warpage, excellent dimensional stability, high heat resistance |
|
LCP |
Vismid庐聽SOL 8365LDS |
30% GF 聽 reinforced, high temperature resistance, high flow, high dimensional 聽 stability, suitable for thin-wall and fast-cycle molding and SMT lead-free 聽 soldering process |
Vismid庐聽SOL 8485LDS |
40% Mineral reinforced, high temperature resistance, 聽 high flow, low warpage, high dimensional stability, suitable for thin-wall 聽 and fast-cycle molding and SMT lead-free soldering process |
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